Investigation of the effect of technological parameters on efficiency of chemical string cutting of semiconductor materials von Kravetsky, M.Yu., Sypko, S.A., Fomin, A.V.

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Model of smoothing roughness on GaAs wafer surface by using nonabrasive chemical-and-mechanical polishing von Fomin, A.V., Pashchenko, G.A., Kravetskyi, M.Yu., Lutsyshyn, I.G.

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Balance model for contactless chemo-mechanical polishing of wafers von Grigoriev, N.N., Kravetsky, M.Yu., Paschenko, G.A., Sypko, S.A., Fomin, A.V.

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