The energy balance of the asymmetric combined inductive-capacitive RF discharge at low pressure
The combined inductive-capacitive RF discharge at low gas pressure is considered for a case of collisionless ion motion. The power distribution model in the combined RF discharge in case of two asymmetric RF electrodes is developed in term of a ratio of the electrode areas and in term of a magnitude...
Збережено в:
Дата: | 2003 |
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Автори: | , , |
Формат: | Стаття |
Мова: | English |
Опубліковано: |
Національний науковий центр «Харківський фізико-технічний інститут» НАН України
2003
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Назва видання: | Вопросы атомной науки и техники |
Теми: | |
Онлайн доступ: | http://dspace.nbuv.gov.ua/handle/123456789/110619 |
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Назва журналу: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
Цитувати: | The energy balance of the asymmetric combined inductive-capacitive RF discharge at low pressure / A.V. Zykov, K.I. Polozhiy, V.I. Farenik // Вопросы атомной науки и техники. — 2003. — № 1. — С. 130-132. — Бібліогр.: 12 назв. — англ. |
Репозитарії
Digital Library of Periodicals of National Academy of Sciences of UkraineРезюме: | The combined inductive-capacitive RF discharge at low gas pressure is considered for a case of collisionless ion motion. The power distribution model in the combined RF discharge in case of two asymmetric RF electrodes is developed in term of a ratio of the electrode areas and in term of a magnitude of applied RF voltage. We believe that power distributes on three parts: ionization and acceleration of ions in two electrode-sheath transitions. Two types of design is considered: with one and two RF generators. The dependencies of the dissipated RF power parts are obtained in terms of external discharge parameters. It is revealed an existence of a power maximum on acceleration of ions at electrode, which has a lower area. Been accorded expression for dependence of optimum discharge parameters. At using the power distribution model results the system parameter correlation’s have been obtained for a maximum process effectiveness of physical sputtering for systems on the basis of combined inductive-capacitive discharge. |
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