Defects in high temperature and high pressure processed Si:N revealed by deuterium plasma treatment

• Дата: 2010
• Автори: Misiuk, A., Barcz, A., Ulyashin, A., Prujszczyk, M., Bak-Misiuk, J., Formanek, P.
• Формат: Стаття
• Мова: English
• Опубліковано: Донецький фізико-технічний інститут ім. О.О. Галкіна НАН України 2010
• Назва видання: Физика и техника высоких давлений
• Онлайн доступ: http://dspace.nbuv.gov.ua/handle/123456789/69328
• Назва журналу: Digital Library of Periodicals of National Academy of Sciences of Ukraine
• Цитувати: Defects in high temperature and high pressure processed Si:N revealed by deuterium plasma treatment / A. Misiuk, A. Barcz, A. Ulyashin, M. Prujszczyk, J. Bak-Misiuk, P. Formanek // Физика и техника высоких давлений. — 2010. — Т. 20, № 4. — С. 53-59. — Бібліогр.: 4 назв. — рос.

Deuterium is accumulated by defects in nitrogen-implanted silicon (Si:N). This effect is investigated for Si:N processed at HT ≤ 1400 K, also under enhanced hydrostatic pressure, HP ≤ 1.1 GPa. Si:N was prepared from Czochralski grown silicon by N₂⁺ implantation at E = 140 keV with nitrogen doses, DN = 1–1.8•10¹⁸ cm⁻². Si:N was subsequently processed in RF deuterium plasma to prepare Si:N,D. Si:N and Si:N,D were investigated by Transmission Electron Microscopy (TEM), X-ray and Secondary Ion Mass Spec- trometry (SIMS) methods, also after additional annealing at 723 K. In heavily implanted Si:N (DN = 1.8•1010¹⁸ cm⁻²), plasma treatment leads to deuterium pile up to сD1 = 2•10²¹ cm⁻³ at a depth, d = 50 nm, while, at d = 80–250 nm, deuterium concentration is practically constant with сD2 = 1•10²¹ cm⁻³. This suggests dominating accumulation of deuterium within the bubble-containing areas. Determination of deuterium depth profiles in Si:N,D can reveal implantation- and processing-induced defects.